{"title":"A four ASIC MCM-C, design for manufacturability and the next generation silicon","authors":"E. Fulcher, S. Patil","doi":"10.1109/96.365473","DOIUrl":null,"url":null,"abstract":"A ceramic MCM was designed and put into volume production. Four identical 15 mm square ASIC devices with 370 bond pads each are wirebonded into a four cavity, co-fired, alumina PGA containing 383 pins. All materials and processes were selected following the design for manufacturability principles in order to minimize risk and insure meeting schedule requirements. The results are smaller size, better electrical performance, and lower cost than four single chip CPGAs. >","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"26 1","pages":"4-8"},"PeriodicalIF":3.0000,"publicationDate":"1995-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/96.365473","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 2
Abstract
A ceramic MCM was designed and put into volume production. Four identical 15 mm square ASIC devices with 370 bond pads each are wirebonded into a four cavity, co-fired, alumina PGA containing 383 pins. All materials and processes were selected following the design for manufacturability principles in order to minimize risk and insure meeting schedule requirements. The results are smaller size, better electrical performance, and lower cost than four single chip CPGAs. >
期刊介绍：
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
