Software-defined board- and chip-level optical interconnects for multi-socket communication and disaggregated computing

N. Pleros, N. Terzenidis, T. Alexoudi, K. Vyrsokinos, G. Kanellos, D. Syrivelis
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Abstract

The vast amount of new data being generated is outpacing the development of infrastructures and continues to grow at much higher rates than MooreâĂŹs law, a problem that is commonly referred to as the âĂIJdata deluge problemâĂİ. This brings current computational machines in the struggle to exceed Exascale processing powers by 2020 and this is where the energy boundary is setting the second, bottom-side alarm: A reasonable power envelope for future Super-computers has been projected to be 20MW, while worldâĂŹs current No. 1 Supercomputer Sunway TaihuLight provides 93 Pflops and requires already 15.37 MW. This simply means that we have reached so far below 10% of the Exascale target but we consume already more than 75% of the tar-geted energy limit! The way to escape is currently following the paradigm of disaggregating and disintegrating resources, massively introducing at the same time optical technologies for interconnect purposes. Disaggregating computing from memory and storage modules can allow for flexible and modular settings where hardware requirements can be tailored to meet the certain energy and performance metrics targeted per application. At the same time, optical interconnect and photonic integration technologies are rapidly replacing electrical interconnects continuously penetrating at deeper hierarchy levels: Silicon photonics have enabled the penetration of optical technology to the computing environment, starting from rack-to-rack and gradually shifting towards board-level communications. In this article, we present our recent work towards implementing on-board single-mode optical interconnects that can support Software Defined Networking allowing for programmable and flexible computational settings that can quickly adapt to the application requirements. We present a programmable 4×4 Silicon Photonic switch that supports SDN through the use of Bloom filter (BF) labeled router ports. Our scheme significantly simplifies packet forwarding as it negates the need for large forwarding tables, supporting at the same time network size and topol-ogy changes through simple modifications in the assigned BF labels. We demonstrate 1×4 switch operation controlling the Si-Pho switch by a Stratix V FPGA board that is responsible for processing the packet ID and correlating its destination with the appropriate BF-labeled switch output port. Moving towards high-capacity board-level settings, we discuss the architecture and technology being currently promoted by the recently started H2020 project ICT-STREAMS, where single-mode optical PCBs hosting Si-based routing modules and mid-board transceiver optics expect to enable a massive any-to-any, buffer-less, collision-less and extremely low latency routing platform with 25.6Tb/s aggregate through-put. This architecture and technology are also extended to support resource disaggregation in data centers as currently being pursued in the H2020 project dREDBox, where the any-to-any collisionless routing scheme is proposed for connecting disaggregated computing and memory bricks trying to minimize remote memory access latency and energy consumption.
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用于多套接字通信和分解计算的软件定义板级和芯片级光互连
产生的大量新数据的速度超过了基础设施的发展速度,并继续以比MooreâĂŹs法律高得多的速度增长,这个问题通常被称为âĂIJdata洪水problemâĂİ。这使得目前的计算机器在2020年的处理能力超过百亿亿次,这是能量边界设置的第二个,底部的警报:未来超级计算机的合理功率包线预计为20MW,而worldâĂŹs目前排名第一的超级计算机神威太湖之光提供93 Pflops,已经需要15.37 MW。这仅仅意味着,到目前为止,我们只达到了百亿亿次目标的10%以下,但我们消耗的能量已经超过了目标能量限制的75% !目前,逃避的方法是遵循分解和分解资源的范式,同时大规模引入用于互联目的的光学技术。从内存和存储模块中分离计算可以允许灵活和模块化的设置,可以定制硬件要求,以满足每个应用程序的特定能源和性能指标。与此同时,光互连和光子集成技术正在迅速取代电气互连,并不断向更深层次渗透:硅光子学使光学技术渗透到计算环境,从机架到机架逐渐转向板级通信。在本文中,我们介绍了我们最近在实现机载单模光互连方面的工作,该互连可以支持软件定义网络,允许可编程和灵活的计算设置,可以快速适应应用需求。我们提出了一个可编程的4×4硅光子交换机,它通过使用布隆滤波器(BF)标记的路由器端口来支持SDN。我们的方案大大简化了数据包转发,因为它不需要大型转发表,同时通过简单修改分配的BF标签来支持网络规模和拓扑的变化。我们演示了1×4开关操作,通过Stratix V FPGA板控制Si-Pho开关,该板负责处理数据包ID并将其目的地与适当的bf标记交换机输出端口相关联。转向高容量板级设置,我们讨论了最近启动的H2020项目ICT-STREAMS目前正在推广的架构和技术,其中单模光pcb承载基于si的路由模块和中板收发器光学器件,有望实现具有25.6Tb/s总吞吐量的大规模任意对任意、无缓冲、无碰撞和极低延迟的路由平台。这种架构和技术也被扩展到支持数据中心的资源分解,正如H2020项目dREDBox目前所追求的那样,其中提出了任意对任意的无冲突路由方案,用于连接分解的计算和内存块,以尽量减少远程内存访问延迟和能耗。
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