Cuiping Wang, Jian Wang, Liang Chen, Yuechan Li, Xingjun Liu
{"title":"Study on soldering flux used for Sn-0.7Cu welding wire","authors":"Cuiping Wang, Jian Wang, Liang Chen, Yuechan Li, Xingjun Liu","doi":"10.1109/ISAPM.2011.6105709","DOIUrl":null,"url":null,"abstract":"The wettability and corrosiveness of some organic acids were tested to choose an appropriate activator. Then orthogonal design method was used to determine the proportion among the components of the activator. At last a certain amount of water-white rosin was added to further optimize the dispensation. The final soldering flux for Sn-0.7Cu welding wire caters to the demands of welding process such as good weld ability, good liquidity, less smoke, full and shiny welding spot.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Symposium on Advanced Packaging Materials (APM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2011.6105709","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The wettability and corrosiveness of some organic acids were tested to choose an appropriate activator. Then orthogonal design method was used to determine the proportion among the components of the activator. At last a certain amount of water-white rosin was added to further optimize the dispensation. The final soldering flux for Sn-0.7Cu welding wire caters to the demands of welding process such as good weld ability, good liquidity, less smoke, full and shiny welding spot.