Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments

K. Becker, S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, S. Gottwald, A. Hofmeister, M. Hesse, M. Thies, S. Mehrafsun, R. Fust, E. Beck, J. Pawlikowski, B. Schröder, C. Voight, T. Braun, M. Schneider-Ramelow
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Abstract

Digitization is one of the hot topics in all Industry 4.0 efforts that are currently discussed. Often the focus is on digitization of business processes with a financial/organizational perspective on manufacturing, so the tools are adapting to enterprise resource planning [ERP] and manufacturing execution system [MES] rather than on actual manufacturing issues on the shop floor. Within the SiEvEI 4.0 project, a research consortium from the area of electronics manufacturing is working on digitization for a manufacturing scenario where high value electronic goods are built in a distributed manufacturing environment. The key research topics addressed are the implementation of a Chain of Trust [CoT] for such a distributed manufacturing, i.e. and the application of artificial intelligence/machine learning to analyze and eventually optimize manufacturing processes. The paper will introduce the concept of both COT and AI-based process analysis that will later on transferred into a microelectronics production environment. Two reference processes are targeted, SMD assembly using fully automated manufacturing equipment and Solder Ball Application using a high-mix/low volume concept. As a result, the paper presents a concept of how to digitize manufacturing processes and use this digital description of a process combination to make a distributed manufacturing flow safe and increase product/process quality.
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在微电子制造研究环境中实现可信制造和基于人工智能的工艺优化
数字化是目前讨论的所有工业4.0努力中的热门话题之一。通常,重点是业务流程的数字化,从财务/组织的角度来看制造,因此这些工具适应企业资源规划[ERP]和制造执行系统[MES],而不是车间的实际制造问题。在SiEvEI 4.0项目中,来自电子制造领域的一个研究联盟正在研究在分布式制造环境中制造高价值电子产品的制造场景的数字化。关键的研究课题是为这种分布式制造实现信任链,即应用人工智能/机器学习来分析和最终优化制造过程。本文将介绍COT和基于人工智能的过程分析的概念,这些概念随后将转移到微电子生产环境中。有两种参考工艺,采用全自动制造设备的SMD组装和采用高混合/低批量概念的Solder Ball应用。因此,本文提出了如何将制造过程数字化的概念,并利用这种过程组合的数字化描述使分布式制造流程安全并提高产品/过程质量。
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