P. Mendes, A. Polyakov, M. Bartek, J. Burghartz, J. Correia
{"title":"An integrated folded-patch antenna for wireless microsystems","authors":"P. Mendes, A. Polyakov, M. Bartek, J. Burghartz, J. Correia","doi":"10.1109/ICSENS.2004.1426206","DOIUrl":null,"url":null,"abstract":"A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks, has been realized and characterized. Overall dimensions of 4/spl times/4/spl times/1 mm/sup 3/, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through-substrate electrical vias and 3D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.","PeriodicalId":20476,"journal":{"name":"Proceedings of IEEE Sensors, 2004.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Sensors, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSENS.2004.1426206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks, has been realized and characterized. Overall dimensions of 4/spl times/4/spl times/1 mm/sup 3/, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through-substrate electrical vias and 3D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.
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