An investigation of the influence of intermetallic compounds on compressivecreep of SAC305/copper solder joints by modeling

Abstract

The compressive creep deformation of SAC305/copper solder joints is tested at 12.739MPa and different temperatures ranging from 343K to 463K. The experimental results were analyzedby curve fitting with time hardening model incorporated in Abaqus™. The influence of intermetallic compounds on compressive creep deformation was also studied by modeling with the parameters of time hardening model which were derived from curve fitting. The modeling results show that deformability of the solders descends sharply at all temperatures, from 343K to 463K, as the volume ratio of intermetallic compounds layer increases. But the distribution of deformation is much more homogeneous, and the deformability of solders becomes similar at different temperatures when the ratio of IMCs is relatively higher.