J. Hostetler, Xueqing Li, P. Alexandrov, Xing Huang, A. Bhalla, M. Becker, Joseph Colombo, Derrick Dieso, J. Sherbondy
{"title":"6.5kV enhancement mode SiC JFET based power module","authors":"J. Hostetler, Xueqing Li, P. Alexandrov, Xing Huang, A. Bhalla, M. Becker, Joseph Colombo, Derrick Dieso, J. Sherbondy","doi":"10.1109/WIPDA.2015.7369291","DOIUrl":null,"url":null,"abstract":"United Silicon Carbide, Inc. (USCi) has developed a novel low-loss 6.5kV enhancement-mode SiC JFET chipset to address transformerless grid-tie, variable frequency drives (VFD) for industrial motors, heavy vehicle motor traction and other high DC-link voltage applications. The JFET devices demonstrate excellent switching losses, approximately ~20X less than 6.5kV Si-IGBTs. The new JFET devices were packaged along with 6.5kV rated SiC JBS diodes in a half-bridge configuration to form an all-SiC high temperature power module rated at 60A. The module performance parameters vs. temperature were evaluated and are presented. Turn-on and turn-off behavior of the module and the nature of paralleling enhancement-mode JFETs are presented. The power modules were tested in a buck converter where switching a bus voltage of 3.3kV at 10kHz and 15kHz was achieved and module power losses estimated. The fast-switching medium voltage SiC module can have a large impact on reducing system components and targets next generation power conversion systems seeking higher power densities.","PeriodicalId":6538,"journal":{"name":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","volume":"37 1","pages":"300-305"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WIPDA.2015.7369291","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
United Silicon Carbide, Inc. (USCi) has developed a novel low-loss 6.5kV enhancement-mode SiC JFET chipset to address transformerless grid-tie, variable frequency drives (VFD) for industrial motors, heavy vehicle motor traction and other high DC-link voltage applications. The JFET devices demonstrate excellent switching losses, approximately ~20X less than 6.5kV Si-IGBTs. The new JFET devices were packaged along with 6.5kV rated SiC JBS diodes in a half-bridge configuration to form an all-SiC high temperature power module rated at 60A. The module performance parameters vs. temperature were evaluated and are presented. Turn-on and turn-off behavior of the module and the nature of paralleling enhancement-mode JFETs are presented. The power modules were tested in a buck converter where switching a bus voltage of 3.3kV at 10kHz and 15kHz was achieved and module power losses estimated. The fast-switching medium voltage SiC module can have a large impact on reducing system components and targets next generation power conversion systems seeking higher power densities.