Qualification and testing process to implement anti-counterfeiting technologies into IC packages

Abstract

Counterfeiting is no longer limited to just fashion or luxury goods, the phenomenon has now reached electronics components which failure represents a high risk to the safety and security of human communities. One way for the semiconductor (SC) industry to fight against counterfeiting of electronic parts is to add technological innovation at the component level itself. The target is to enable the product authentication in a fast and reliable way. Because semiconductor manufacturing is a complex and delicate operation producing highly complex products which are sensitive to many environmental factors, any introduction of changes in its production - which the implementation of anti-counterfeiting (A/C) technologies must also comply to - must undergo thorough testing and qualification steps. This is mandatory to control the compliancy to the strict delivery requirements, quality and reliability level the industry has established, in line with the product performance specifications. This paper aims to explain the comprehensive requirements specification developed by members of semiconductor and related industries in Europe, to add authentication technologies solutions into IC packages. It also describes the qualification processes and testing plans to implement the most adequate and effective anti-counterfeiting technology (A/T). One of the main challenges in this A/C task is to make sure that the added A/C feature in electronic components does not create any additional reliability or failure issue, nor introduce additional risks that will benefit counterfeiters.