{"title":"The introduction of high heat dissipation material","authors":"G. Lee, J. Lin","doi":"10.1109/IMPACT.2009.5382129","DOIUrl":null,"url":null,"abstract":"Along with the increase in circuit density, it becomes more difficult to dissipate heat through the surface of the components. Therefore, the designs and applications for the materials used in heat dissipation as well as high thermal conductivity and low CTE have become the focal point for discussion.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"39 1","pages":"240-243"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382129","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Along with the increase in circuit density, it becomes more difficult to dissipate heat through the surface of the components. Therefore, the designs and applications for the materials used in heat dissipation as well as high thermal conductivity and low CTE have become the focal point for discussion.
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