{"title":"Assembly-Induced Stress and Its Effect on the Integrity of Assembly System in Drop Simulation","authors":"W. Ren, Jianjun Wang","doi":"10.1109/ESIME.2006.1643977","DOIUrl":null,"url":null,"abstract":"In this paper, a drop vehicle of LCD system was selected to address the assembly-induced stress and its effect on the integrity of assembly system in drop simulation. A finite element procedure was implemented to analyze a two-step loaded LCD system in terms of ABAQUS/Standard and ABAQUS/Explicit tools. Firstly, the LCD is statically loaded by the pretension of the screws and the pressure of the elastomer to determine the stress/strain equilibrium by using the ABAQUS/Standard tool. Secondly, the pre-stressed LCD system is loaded by dropping it from one and half meters high onto a hard floor to assess its reliability under impact loading by means of the ABAQUS/Explicit tool. From the finite element analysis, it is found that the maximum stress level obtained from a model without assembly-induced pre-stressing is generally smaller than that obtained from a model with assembly-induced pre-stressing. In addition, the effect of the ratio of the pressed thickness of the elastomer to the non-pressed thickness of the elastomer on the LCD reliability was investigated based on the proposed procedure. An optimized ratio was recommended","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"6 1","pages":"1-7"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1643977","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, a drop vehicle of LCD system was selected to address the assembly-induced stress and its effect on the integrity of assembly system in drop simulation. A finite element procedure was implemented to analyze a two-step loaded LCD system in terms of ABAQUS/Standard and ABAQUS/Explicit tools. Firstly, the LCD is statically loaded by the pretension of the screws and the pressure of the elastomer to determine the stress/strain equilibrium by using the ABAQUS/Standard tool. Secondly, the pre-stressed LCD system is loaded by dropping it from one and half meters high onto a hard floor to assess its reliability under impact loading by means of the ABAQUS/Explicit tool. From the finite element analysis, it is found that the maximum stress level obtained from a model without assembly-induced pre-stressing is generally smaller than that obtained from a model with assembly-induced pre-stressing. In addition, the effect of the ratio of the pressed thickness of the elastomer to the non-pressed thickness of the elastomer on the LCD reliability was investigated based on the proposed procedure. An optimized ratio was recommended
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