Advanced wire bonding standards for European automotive and power electronics industry

S. Schmitz, M. Schneider-Ramelow
{"title":"Advanced wire bonding standards for European automotive and power electronics industry","authors":"S. Schmitz, M. Schneider-Ramelow","doi":"10.4071/1085-8024-2021.1.000339","DOIUrl":null,"url":null,"abstract":"\n This article presents the wire bond standard DVS-2811, which is widely used in German-speaking and European countries. Introduced in 1996, this standard now contains definitions and limits for all currently used bonding methods, including the shear test on heavy/thick wire bond connections, which is missing in all other official standards. Especially considering the growing number of users in battery bonding, the specification of appropriate limits for testing thick wires is of important significance. In addition to an overview of the current status, an outlook is given on further updates that are due in the next 1–2 years.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"69 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000339","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

This article presents the wire bond standard DVS-2811, which is widely used in German-speaking and European countries. Introduced in 1996, this standard now contains definitions and limits for all currently used bonding methods, including the shear test on heavy/thick wire bond connections, which is missing in all other official standards. Especially considering the growing number of users in battery bonding, the specification of appropriate limits for testing thick wires is of important significance. In addition to an overview of the current status, an outlook is given on further updates that are due in the next 1–2 years.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
为欧洲汽车和电力电子行业提供先进的线接标准
本文介绍了在德语国家和欧洲国家广泛使用的线键标准DVS-2811。该标准于1996年推出,现在包含了所有当前使用的粘合方法的定义和限制,包括在所有其他官方标准中缺失的重/粗线粘合连接的剪切试验。特别是考虑到越来越多的用户在电池粘接,规范适当的限制测试粗线是具有重要意义的。除了对当前状态的概述外,还对未来1-2年的进一步更新进行了展望。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application Coronavirus, chip boom, and supply shortage: The new normal for global semiconductor manufacturing Lithography Solutions for Submicron Panel-Level Packaging
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1