{"title":"Thermal Performance and Reliability of Thermal Interface Materials: A Review","authors":"P. Rodgers, V. Eveloy, E. Rahim, D. Morgan","doi":"10.1109/ESIME.2006.1644070","DOIUrl":null,"url":null,"abstract":"This paper presents a survey of the thermal performance of a range of TIMs (adhesives, greases, phase change materials (PCMs) and thermal pads) from different vendors. Previously published studies on TIM thermal performance characterization and reliability assessment for electronics packaging are reviewed. The potential limitations of ASTM D 5470 standard, and TIM industry thermal impedance characterization practices utilizing this standard are discussed, as well as alternative characterization approaches. From this analysis, guidelines are derived on TIM selection from thermal performance and reliability perspectives","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"7 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1644070","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
This paper presents a survey of the thermal performance of a range of TIMs (adhesives, greases, phase change materials (PCMs) and thermal pads) from different vendors. Previously published studies on TIM thermal performance characterization and reliability assessment for electronics packaging are reviewed. The potential limitations of ASTM D 5470 standard, and TIM industry thermal impedance characterization practices utilizing this standard are discussed, as well as alternative characterization approaches. From this analysis, guidelines are derived on TIM selection from thermal performance and reliability perspectives
本文介绍了来自不同供应商的一系列TIMs(粘合剂、润滑脂、相变材料和热垫)的热性能调查。综述了电子封装用TIM热性能表征和可靠性评估方面的研究成果。讨论了ASTM D 5470标准的潜在局限性，以及利用该标准的TIM工业热阻抗表征实践，以及替代表征方法。根据这一分析，从热性能和可靠性的角度得出了TIM选择的指导方针
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