{"title":"Welcome message from An-Yeu Wu, conference co-chair","authors":"A. Wu","doi":"10.1109/IMPACT.2009.5382219","DOIUrl":null,"url":null,"abstract":"Thank you for participating in IMPACT Conference 2009 and International 3D IC Conference. Due to the trend of 3D IC technology and development are discussed popularly in the world; SIPO especially holds this joint conference with IMPACT to introduce more about 3D IC technology in this conference.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"43 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382219","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Thank you for participating in IMPACT Conference 2009 and International 3D IC Conference. Due to the trend of 3D IC technology and development are discussed popularly in the world; SIPO especially holds this joint conference with IMPACT to introduce more about 3D IC technology in this conference.
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