Nanotechnology for lead-free PWB final finishes with the Organic Metal

Abstract

For the first time, a thin layer of only a few nano-meters has been deposited onto copper pads of printed circuit boards which provides effective protection against oxidation and preserves its solderability. The Nano layer has a thickness of nominally only 50 nm, and contains the Organic Metal (conductive polymer) and a small amount of silver. With ≪ 90% (by volume), the Organic Metal is the major component of the deposited layer, Ag is present equivalent to a thickness of 4 nm. This Organic Metal - Ag complex final finish outperforms any established surface finishes.