Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers under Consideration of the Operating Time and Conditions

A. Schiffmacher, J. Wilde, Carsten Kempiak, A. Lindemann, J. Rudzki, F. Osterwald
{"title":"Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers under Consideration of the Operating Time and Conditions","authors":"A. Schiffmacher, J. Wilde, Carsten Kempiak, A. Lindemann, J. Rudzki, F. Osterwald","doi":"10.1109/ectc32862.2020.00094","DOIUrl":null,"url":null,"abstract":"In this work an investigation of the thermomechanical deformation behaviour of power modules with sintered metal buffer layers is presented under consideration of the operating time. The thermomechanical deformation is measured during active operation of the device using an optical measurement technique. The in-plane strain and the out-of-plane curvature were evaluated in dependency of the temperature by applying different operating conditions (IC, ton, toff). In addition, comparisons of the deformations of modules are shown, which on the one hand were measured directly after the production and on the other hand have passed through several thousand active load cycles until the end-of-life (EOL). Furthermore, the relevant electrical and thermal parameters (VCE,Sat, Tvj,max, ΔTvj, Rth) were recorded during the load cycles in order to analyse the failure mechanisms. The evaluation of the electrical measurement with regard to the failure mechanism correlates with the findings of the thermomechanical deformation. The uncertainty regarding the primary failure mechanism, which exists when evaluating only VCE and Rth, can be eliminated with the additional optical method without destroying the test module.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"29 1","pages":"561-567"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc32862.2020.00094","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

In this work an investigation of the thermomechanical deformation behaviour of power modules with sintered metal buffer layers is presented under consideration of the operating time. The thermomechanical deformation is measured during active operation of the device using an optical measurement technique. The in-plane strain and the out-of-plane curvature were evaluated in dependency of the temperature by applying different operating conditions (IC, ton, toff). In addition, comparisons of the deformations of modules are shown, which on the one hand were measured directly after the production and on the other hand have passed through several thousand active load cycles until the end-of-life (EOL). Furthermore, the relevant electrical and thermal parameters (VCE,Sat, Tvj,max, ΔTvj, Rth) were recorded during the load cycles in order to analyse the failure mechanisms. The evaluation of the electrical measurement with regard to the failure mechanism correlates with the findings of the thermomechanical deformation. The uncertainty regarding the primary failure mechanism, which exists when evaluating only VCE and Rth, can be eliminated with the additional optical method without destroying the test module.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
考虑工作时间和条件下带烧结金属缓冲层电源模块的热力变形
本文研究了具有烧结金属缓冲层的功率模块在考虑工作时间的情况下的热力变形行为。利用光学测量技术测量设备主动工作时的热机械变形。在不同的工作条件下(IC、ton、toff),评估了面内应变和面外曲率与温度的关系。此外,还显示了模块变形的比较,这些变形一方面是在生产后直接测量的,另一方面是经过数千个主动负载循环直到使用寿命结束(EOL)。此外,在负载循环过程中记录了相关的电学和热参数(VCE,Sat, Tvj,max, ΔTvj, Rth),以分析失效机制。电学测量对破坏机制的评价与热变形的发现有关。仅评估VCE和Rth时存在的主要失效机制的不确定性可以通过附加的光学方法消除,而不会破坏测试模块。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Thermal aging reliability of socketable, surface-modified solder BGAs with and without polymer collars Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining Photosensitive polymer reliability for fine pitch RDL applications Characterization and Application of a Novel Permanent Bonding Material ECTC 2020 Breaker Page
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1