High energy hydrogen and helium ion implanter

Shengwu Chang, Brian Gori, Curt Norris, J. Klein, Kurt Decker-Lucke
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引用次数: 2

Abstract

High energy hydrogen and helium ion implants are required for enhancing performance of advanced power devices, such as improving breakdown voltage and switching response for IGBT products. The Varian Semiconductor Equipment business unit of Applied Materials has employed the VIISta platform architecture to provide production level throughputs of high energy hydrogen and helium for both standard and thin wafer substrates. Improvements to the implanter architecture will be described. The beam optics optimization, including the charge-exchange resonance and light species transport, will be discussed. The design and implementation of the radiation mitigation system, which meets industry standards for radiation limits and allows for operation in a typical production environment, will be described. Overall productivity and thin wafer implant capability are presented.
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高能氢、氦离子注入器
高能氢离子和氦离子植入物是提高先进功率器件性能的必要条件,如提高IGBT产品的击穿电压和开关响应。应用材料公司的瓦里安半导体设备业务部采用VIISta平台架构,为标准和薄晶片基板提供高能氢和氦的生产水平。将描述对植入器结构的改进。讨论了光束光学优化,包括电荷交换共振和光种输运。将介绍辐射缓解系统的设计和实施,该系统符合辐射限值的工业标准,并允许在典型的生产环境中运行。介绍了整体生产效率和薄晶片植入能力。
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