T. Kuo, T. Shih, Yin-Hsien Su, Wen-Hsi Lee, W. Liao
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引用次数: 0
Abstract
Molybdenum-Tungsten (MoxW) alloy films were deposited on SiO2 substrates by reactive sputtering. Direct electroplating Cu on Molybdenum-Tungsten alloy films and annealing in N2 were carried out. In this study, the effect of electroplating time and annealing temperature on the structural, plating and wetting ability of Molybdenum-Tungsten alloy films was investigated. The films were characterized by X-ray photoelectron spectroscopy (XPS) and scanning electron microscope (SEM). The results show that Cu can be directly electroplated on Molybdenum-Tungsten alloy films with uniform nucleation. After annealing, de-wetting behavior of Molybdenum-Tungsten alloy films are shown to be better than Ta even up to 500°C.
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