Development of vertically stacked packaging based miniaturized camera electronics for high resolution imaging payloads

Shweta Kirkire, Ashok Kumar, M. Karimi, Amarnath, Hanuman Prasad, Ashish Srivastava, Sanjeev Mehta, Sandip Paul, R. Parmar, D. Samudraiah
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引用次数: 1

Abstract

Future Remote Sensing Satellites with high resolution electro-optical payloads require multiple detectors to meet mission goals of multiple spectral bands and large swath. High speed detectors are available with limited pixels array length with multiple video ports. Large number of detectors at the focal plane calls for miniaturized camera electronics. Miniaturization requires usage of low power, low weight components and adaption of new packaging techniques like Multi chip module, System-in Package, Systems-on-chip and wafer level packaging etc. These technologies require multiple dice which are not readily available in required high quality levels. Hence, new packaging approach named as vertically stacked packaging (VSP) is developed in-house and demonstrated. This incorporates vertical stacking of PCBs, inter-board interfaces using copper leads, usage of flexi-rigid boards, single external interface connector and vertical passive component mounting. Here, using VSP technology, reduction is achieved in size by about 91% and weight by about 85% as compared to traditional packaging approaches. This paper mainly discusses the VSP development, optimization and integrated test results with 4K TDI detector.
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用于高分辨率成像载荷的垂直堆叠封装小型化相机电子器件的开发
未来具有高分辨率光电有效载荷的遥感卫星需要多个探测器来满足多光谱带和大波段的任务目标。高速探测器具有有限的像素阵列长度,具有多个视频端口。焦平面上的大量探测器需要小型化的相机电子设备。小型化要求使用低功耗、低重量的组件,并采用新的封装技术,如多芯片模块、系统级封装、系统级芯片和晶圆级封装等。这些技术需要多个骰子,而这些骰子在要求的高质量级别中并不容易获得。因此,新的包装方法命名为垂直堆叠包装(VSP)是内部开发和演示。这包括pcb的垂直堆叠,使用铜线的板间接口,使用柔性刚性板,单个外部接口连接器和垂直无源组件安装。在这里,使用VSP技术,与传统包装方法相比,尺寸减少了约91%,重量减少了约85%。本文主要讨论了VSP的开发、优化以及与4K TDI探测器的集成测试结果。
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