{"title":"Thermal management details and their influence on the aging of power semiconductors","authors":"M. Schulz","doi":"10.1109/EPE.2014.6910898","DOIUrl":null,"url":null,"abstract":"The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered.","PeriodicalId":6508,"journal":{"name":"2014 16th European Conference on Power Electronics and Applications","volume":"52 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 16th European Conference on Power Electronics and Applications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPE.2014.6910898","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered.
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