Laser welding of copper and copper alloys

IF 0.1 4区 计算机科学 Q4 Engineering Fujitsu Scientific & Technical Journal Pub Date : 1991-01-01 DOI:10.2351/1.4745272
K. Shimizu, K. Hashimoto
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引用次数: 14

Abstract

We have developed a laser hermetic sealing technique that combines nickel plating with laser welding for copper and copper alloy bellows for general purpose large‐scale computers. Laser welding of copper has been difficult because of copper's high thermal conductivity and reflectivity. However, laser welding nickel‐plated copper results in deep penetration. To avoid corrosion induced at the dissimilar metal contact between nickel and copper, the nickel‐plated copper was heat‐treated before welding to obtain a nickel‐copper solid solution. Then, the optimum plating thickness and heat‐treatment conditions were determined. A 10 μm‐thick nickel plating, heat‐treated for 1 h at 1000°C was found to be best suited to laser welding. These conditions make the laser weld of copper and copper alloy strong. Tests indicate that this technique is suitable for laser welding copper and copper alloys.
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铜及铜合金的激光焊接
我们开发了一种激光密封技术,将镀镍和激光焊接相结合,用于通用大型计算机的铜和铜合金波纹管。由于铜的高导热性和高反射率,激光焊接一直是铜的难点。然而,激光焊接镀镍铜导致深熔。为了避免在镍和铜之间的异种金属接触处引起腐蚀,在焊接前对镀镍铜进行热处理以获得镍铜固溶体。然后,确定了最佳镀层厚度和热处理条件。镀镍层厚度为10 μm,在1000℃下热处理1 h,最适合激光焊接。这些条件使铜及铜合金的激光焊接牢固。试验表明,该技术适用于铜及铜合金的激光焊接。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Fujitsu Scientific & Technical Journal
Fujitsu Scientific & Technical Journal 工程技术-工程:电子与电气
自引率
0.00%
发文量
0
审稿时长
6-12 weeks
期刊介绍: FSTJ is published by FUJITSU LIMITED to introduce the FUJITSU Group''s research and development activities, cutting-edge technologies, products, and solution services.
期刊最新文献
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