S. Sukegawa, T. Umebayashi, T. Nakajima, Hiroshi Kawanobe, K. Koseki, I. Hirota, T. Haruta, Masanori Kasai, Koji Fukumoto, T. Wakano, Keishi Inoue, Hiroshi Takahashi, T. Nagano, Y. Nitta, T. Hirayama, Noriyuki Fukushima
{"title":"A 1/4-inch 8Mpixel back-illuminated stacked CMOS image sensor","authors":"S. Sukegawa, T. Umebayashi, T. Nakajima, Hiroshi Kawanobe, K. Koseki, I. Hirota, T. Haruta, Masanori Kasai, Koji Fukumoto, T. Wakano, Keishi Inoue, Hiroshi Takahashi, T. Nagano, Y. Nitta, T. Hirayama, Noriyuki Fukushima","doi":"10.1109/ISSCC.2013.6487825","DOIUrl":null,"url":null,"abstract":"In recent years, cellphone cameras have come to require much more diversification and increased functionalities, due to the strong growth of the smartphone market. In addition to the image quality, speed, and pixel counts that conventional image sensors require, there is high demand for new functions that can respond to various photo-taking scenes. We developed a stacked CMOS image sensor (CIS), composed of conventional back-illuminated (BI) image-sensor technology and 65nm standard logic technology.","PeriodicalId":6378,"journal":{"name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","volume":"57 1","pages":"484-485"},"PeriodicalIF":0.0000,"publicationDate":"2013-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"146","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2013.6487825","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 146
Abstract
In recent years, cellphone cameras have come to require much more diversification and increased functionalities, due to the strong growth of the smartphone market. In addition to the image quality, speed, and pixel counts that conventional image sensors require, there is high demand for new functions that can respond to various photo-taking scenes. We developed a stacked CMOS image sensor (CIS), composed of conventional back-illuminated (BI) image-sensor technology and 65nm standard logic technology.
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