iNEMI HFR-free leadership program

S. Tisdale, R. Pfahl, H. Fu
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Abstract

The electronics industry is aggressively pursuing the removal of potentially toxic compounds from their products, including the halogenated flame retardants (HFRs) that were once widely used in electronics housings and cases and are still used extensively in printed circuit boards. Several leading electronics companies have publicly stated their intent to remove brominated and/or halogenated flame retardants from some or all of their products. The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, is working with a number of its OEM and supply chain members to assess the feasibility of a broad conversion to HFR-free PCB materials. While IPC and JEDEC are developing halogen-free standard specifications and numerous companies have compliant materials, significant questions remain regarding overall readiness to make a transition to these materials. This paper will discuss results & conclusions from the completed iNEMI HFR-free PCB Materials Project, as well as outline current projects, which include the HFR-free High-Reliability PCB project, the HFR-free Signal Integrity
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iNEMI无hfr领导力计划
电子工业正在积极地从其产品中去除潜在的有毒化合物,包括卤化阻燃剂(HFRs),这种阻燃剂曾广泛用于电子产品的外壳和外壳,目前仍广泛用于印刷电路板。几家领先的电子公司已经公开表示,他们打算从部分或全部产品中去除溴化和/或卤化阻燃剂。国际电子制造倡议(iNEMI)是一个行业主导的联盟,正在与一些OEM和供应链成员合作,评估广泛转换为不含hfr的PCB材料的可行性。虽然IPC和JEDEC正在开发无卤标准规范,许多公司都有符合要求的材料,但在向这些材料过渡的总体准备情况方面仍然存在重大问题。本文将讨论已完成的iNEMI无hfr PCB材料项目的结果和结论,并概述当前的项目,包括无hfr高可靠性PCB项目,无hfr信号完整性项目
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