{"title":"Novel lithography technology for enhancing resolution limit at advanced packaging manufacturing","authors":"H. Matsui","doi":"10.4071/1085-8024-2021.1.000045","DOIUrl":null,"url":null,"abstract":"\n New lithography method will be proposed in the paper to enhance resolution limit by half of current one while keeping depth of focus at the same value. The method is based on lithography and copper plating process in order to be applicable to advanced packaging manufacturing.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"65 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000045","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
New lithography method will be proposed in the paper to enhance resolution limit by half of current one while keeping depth of focus at the same value. The method is based on lithography and copper plating process in order to be applicable to advanced packaging manufacturing.
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