Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications

Abstract

This work presents, for the first time, a package- level, bare die liquid jet impingement 3D polymer microfluidics heatsink fabricated using 3D printing, or additive manufacturing for large die size and high-power applications. The heatsink achieves a chip temperature increase of 17.5°C at a chip power of 285 W for a coolant flow rate of 3.25 LPM, demonstrating that 3D printing enables the design for low-cost, high efficiency direct on-chip microfluidic heatsink with complex internal 3D manifold liquid delivery channels. The measurement results show that the jet impingement cooling performance can be successfully described using a unit cell approach, allowing an easy scaling of the thermal performance for arbitrary die size applications. Long term thermal tests of 1000h show a constant thermal performance and no degradation of the cooler material.