Bondpad Design Structural vs. Electrical Tradeoffs

B. Williams, Robert Davis, Justin Yerger, D. Allman, B. Greenwood, T. Ruud
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Abstract

This paper will demonstrate wirebond pad design considerations for the source pad of a power trenchFET using three levels of metal. There will be a discussion of how the pad design will impact the pad mechanical strength through the bonding process. There will also be a comparison of bondpad design to thermal/electrical simulation results. An optimal design can be obtained by an analysis of these tradeoffs. Finally the proposed designs have been built on silicon and evaluated both mechanically and electrically concluding with best design found for this application.
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键合板设计结构与电气的权衡
本文将演示使用三层金属的功率沟槽场效应管源焊盘的线键焊盘设计考虑。将讨论焊盘设计如何通过粘合过程影响焊盘的机械强度。还将对键合板设计与热/电模拟结果进行比较。通过对这些权衡的分析,可以得到最优设计。最后,提出的设计已经建立在硅上,并进行了机械和电气评估,得出了适合该应用的最佳设计。
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