{"title":"Design, fabrication and electrical characterization of high material constant Chip-in-Glass thermal sensors","authors":"M. Muralidharan, A. Seema, E. Sunny, K. R. Dayas","doi":"10.1109/ISPTS.2012.6260925","DOIUrl":null,"url":null,"abstract":"Nickel manganite based negative temperature coefficient (NTC) thermistor compositions are extensively used as thermal sensors in a wide range of products and devices. Ni0.701Mn1.823Cr0.35Fe0.07Si0.056O4 NTC thermistor composition was prepared through solid state route. The tape casting slurry composition was optimized to get defect free ceramic tapes. Chip thermistors were prepared from these NTC tapes by optimizing the process parameters. The prepared chip thermistors were encapsulated in borosilicate glass to form Chip-in-Glass thermal sensors with high material constant and excellent reliability.","PeriodicalId":6431,"journal":{"name":"2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)","volume":"19 1","pages":"208-211"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 1st International Symposium on Physics and Technology of Sensors (ISPTS-1)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPTS.2012.6260925","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Nickel manganite based negative temperature coefficient (NTC) thermistor compositions are extensively used as thermal sensors in a wide range of products and devices. Ni0.701Mn1.823Cr0.35Fe0.07Si0.056O4 NTC thermistor composition was prepared through solid state route. The tape casting slurry composition was optimized to get defect free ceramic tapes. Chip thermistors were prepared from these NTC tapes by optimizing the process parameters. The prepared chip thermistors were encapsulated in borosilicate glass to form Chip-in-Glass thermal sensors with high material constant and excellent reliability.
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