Rare-Gas Implantation and Damage of Fullerene at High Fluence

V. Hnatowicz, J. Vacik, D. Fink, R. Klett
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引用次数: 1

Abstract

Abstract 100 keV Ar+and Kr+ ions were implanted into fullerene films up to fluences which exceed the fullerene destruction threshold. The depth profiles of implanted atoms were measured using conventional RBS techniques. The depth profile parameters differ significantly from theoretical estimates and with increasing ion fluence the depth profiles move to the sample surface. This suggests a high degree of fullerene sputtering. In annealing experiments at temperatures up to 375 °C no significant changes of the depth profiles were observed.
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高通量下富勒烯的稀有气体注入与破坏
将100 keV的Ar+和Kr+离子注入到富勒烯薄膜中,其影响超过了富勒烯的破坏阈值。利用传统的RBS技术测量注入原子的深度分布。深度剖面参数与理论估计有很大不同,随着离子影响的增加,深度剖面向样品表面移动。这表明有高度的富勒烯溅射。在温度高达375℃的退火实验中,没有观察到深度分布的显著变化。
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