Plasma-cavitation pencil cutter for powerful micro-processing

Abstract

We have successfully developed novel processing equipment based on the combined of cavitation and plasma irradiation. This technique uses the strong points of the powerful ablation of cavitation as well as plasma irradiation. The novelty of the technique enable to process not only conductive material but also non-conductive material such as polymer, CFRP (carbon fiber reinforced plastic) and silicon, which is unlike conventional wire electric discharge machine. Also, the directional transportation of bubbles provides positioning accuracy of micro-processing. The structure of the plasma-cavitation pencil cutter is low cost and very simple structure. This technology contributes to effective processing of wide range of materials such as metal plate, polymer, carbon-fiber and biomaterials.