Evaluation of package-level EMI shielding using conformally coated conductive and magnetic materials in low and high frequency ranges

Kisu Joo, Kyu Jae Lee, Hyun Jun Sung, Seung Jae Lee, Se Young Jeong, H. Park, Yoonhyun Kim
{"title":"Evaluation of package-level EMI shielding using conformally coated conductive and magnetic materials in low and high frequency ranges","authors":"Kisu Joo, Kyu Jae Lee, Hyun Jun Sung, Seung Jae Lee, Se Young Jeong, H. Park, Yoonhyun Kim","doi":"10.1109/ectc32862.2020.00107","DOIUrl":null,"url":null,"abstract":"The magnetic permeability and thickness of magnetic films and their effects on the EMI shielding effectiveness at 1 MHz were investigated. Various kinds of magnetic films having a thickness of 100μm~500μm and a permeability of 50μ~300μ were fabricated. 2D and 3D test vehicles were employed for measuring near-field EMI shielding effectiveness under magnetic source condition. By utilizing 2D and 3D test vehicles, the effects of various magnetic materials on the near-field EMI shielding effectiveness under H-field sources were studied at a low frequency of 1MHz. As a result, we found that the reduction rate of H-field SE is 8.57%, which is very similar to the total opening area of the four sides. the near H-field SE is affected as a logarithmic function of permeability and thickness equally","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"57 1","pages":"647-652"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc32862.2020.00107","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

The magnetic permeability and thickness of magnetic films and their effects on the EMI shielding effectiveness at 1 MHz were investigated. Various kinds of magnetic films having a thickness of 100μm~500μm and a permeability of 50μ~300μ were fabricated. 2D and 3D test vehicles were employed for measuring near-field EMI shielding effectiveness under magnetic source condition. By utilizing 2D and 3D test vehicles, the effects of various magnetic materials on the near-field EMI shielding effectiveness under H-field sources were studied at a low frequency of 1MHz. As a result, we found that the reduction rate of H-field SE is 8.57%, which is very similar to the total opening area of the four sides. the near H-field SE is affected as a logarithmic function of permeability and thickness equally
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在低频和高频范围内使用共形涂层导电和磁性材料的封装级电磁干扰屏蔽评估
研究了磁膜的磁导率、磁膜厚度及其对1mhz时电磁干扰屏蔽效果的影响。制备了厚度为100μm~500μm、磁导率为50μ m~ 300μ m的各种磁性薄膜。采用二维和三维测试车对磁源条件下近场电磁干扰屏蔽效能进行了测试。利用二维和三维测试车,研究了不同磁性材料对高频源近场电磁干扰屏蔽效能的影响。结果发现,h场SE的还原率为8.57%,与四边总开口面积非常接近。近h场SE是渗透率和厚度的对数函数
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