Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration

Evan Griffith, S. Lim
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Abstract

The semiconductor industry is quickly adopting heterogeneous integration as a solution to allow a large number of dies to be packed onto smaller components, improving cost-performance while expanding functionality. As such, the printing of solder paste formulated for System in Package (SiP) applications is becoming more difficult, with many depositions designed at one point as extremes during testing becoming the norm in industry. This paper will first briefly discuss the evolution of soldering material for heterogeneous integration, as some aspects of solder paste manufacturing, such as powder size, differ significantly from larger scale soldering applications. The objective of this study is to illustrate critical parameters for the printing of SiP paste. Multiple parameters that are important for SiP paste printing applications will be discussed, such as the metal load optimization, paste rheology, and metal powder size, type, and quality.
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异构集成精细特征焊膏印刷的发展与应用
半导体行业正在迅速采用异构集成作为一种解决方案,允许将大量芯片封装在较小的组件上,从而在扩展功能的同时提高成本性能。因此,为封装系统(SiP)应用配制的锡膏的印刷变得越来越困难,在测试过程中,许多沉积在一个点上被设计为极端,成为工业规范。本文将首先简要讨论异质集成焊接材料的发展,因为锡膏制造的某些方面,如粉末尺寸,与大规模焊接应用有很大不同。本研究的目的是阐明SiP浆料印刷的关键参数。将讨论对SiP粘贴打印应用很重要的多个参数,如金属负载优化、粘贴流变性和金属粉末尺寸、类型和质量。
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