A review of thin-film aluminide formation

E.G. Colgan
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引用次数: 142

Abstract

With the continuing drive toward greater device densities and finer dimensions in the microelectronics industry, the required proprerties of the metallization layers have become increasingly stringent. Transition metal aluminides are of great interest due to the use of transition metals as diffusion barriers, to suppress hillock formation, and to increase electromigration resistance. This review seeks to collect all the relevant work on transition metal aluminide formation: initial phase formation, temperature of formation, uniformity of growth, and microstructure of the phase formation. Where data are available, the subsequent phases formed, the growth kinetics, and dominant moving species are included. The Ni-Al system is discussed in detail as it is one of the best understood systems and exhibits typical behavior. The Ti-Al, Al(Cu) system and TiW diffusion barriers are also discussed individually due to their technological importance. As has been found for silicide formation, there are some general patterns of behavior with aluminide formation. In general, the initial aluminide phases to grow are the most Al-rich phases: Co2Al9, Cr2Al13, HfAl3, MoAl12, NbAl3, NiAl3, TaAl3, TiAl3, WAl12, and ZrAl3. There are exceptions, Pd2Al3, Pt2Al3, and VAl3 are the initially growing phases, but are not the most Al-rich phases. Where marker experiments were performed, Al has been identified as the dominant diffusing species during the growth of the initial phase. It has been suggested that the Al-rich initial phase results from the greater supply of Al (relative to transition metal) to the growing interface with exceptions caused by complex (and hence difficult to nucleate) phases. The initial reaction temperatures ranged from 225–250°C for Pd2Al3 and Pt2Al3 to 500–525°C for WAl12 formation. In general, the phase formation is planar, though impurities and grain sizes can modify this. For metals forming high-melting-point compounds, the reaction is more likely to be non-uniform. Though generalized rules have been proposed, there are still many open questions. Our understanding of aluminide formation lags behind that of silicides.

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薄膜铝化物形成的研究进展
随着微电子工业不断向更大的器件密度和更细的尺寸发展,对金属化层的性能要求也越来越严格。过渡金属铝化物由于使用过渡金属作为扩散屏障,抑制丘的形成,并增加电迁移阻力而引起了极大的兴趣。本文旨在收集所有有关过渡金属铝化物形成的相关工作:初始相形成、形成温度、生长均匀性和相形成的微观结构。在有数据的情况下,还包括后续阶段的形成、生长动力学和优势移动物种。详细讨论了Ni-Al系统,因为它是最容易理解的系统之一,并表现出典型的行为。由于Ti-Al、Al(Cu)体系和TiW扩散势垒在技术上的重要性,本文还分别对它们进行了讨论。正如在硅化物的形成中所发现的那样,铝化物的形成也有一些一般的行为模式。总的来说,生长的初始铝化物相是最富al的相:Co2Al9、Cr2Al13、HfAl3、MoAl12、NbAl3、NiAl3、TaAl3、TiAl3、WAl12和ZrAl3。也有例外,Pd2Al3、Pt2Al3和VAl3是最初生长的相,但不是最富al的相。在进行标记实验时,Al已被确定为初始生长阶段的优势扩散物种。有人认为,富Al初始相是由于生长界面的Al供应较多(相对于过渡金属),而复杂相(因此难以成核)则是例外。Pd2Al3和Pt2Al3的初始反应温度为225-250℃,WAl12的初始反应温度为500-525℃。一般来说,相的形成是平面的,尽管杂质和晶粒尺寸可以改变这一点。对于形成高熔点化合物的金属,反应更可能是不均匀的。虽然已经提出了一般化的规则,但仍有许多悬而未决的问题。我们对铝化物形成的认识落后于对硅化物的认识。
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