Achieving Ultra-High Strength of Al-Cu-Li Alloys by the Combination of High Pressure Torsion and Age-Hardening

J. Dong, N. Gao, Ying Chen, Ling-fei Cao, Hui Song, Hannes Fröck, B. Milkereit, M. Starink
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引用次数: 4

Abstract

The combined strengthening effects of high pressure torsion (HPT) and age hardening on a recently developed 3rd generation Al-Cu-Li alloy was investigated. Solution treated samples were processed through HPT at room temperature, followed by low temperature artificial ageing (i.e. T4-HPT-AA). A micro-hardness of ~240 Hv was achieved on ageing at 110°C/60h after HPT. A further improvement in the hardness to ~260 Hv was accomplished by a pre-ageing 110°C/24h before HPT in combination with a post-HPT ageing process at 110°C for 180h (i.e. T6-HPT-AA). These novel multi-stage processes give rise to an increase in hardness by a factor of 2 as compared to the T4 condition (~120 Hv). After HPT the grain size was dramatically refined to the ultrafine-grained (UFG) structure, accompanied by a large amount of dislocations. No long-range ordered precipitates were observed after HPT and subsequent ageing treatments. Instead, atom probe tomography (APT) provided clear evidence that Cu-Mg co-clusters were homogeneously distributed in the matrix of T4 and T6 processed samples and they segregate strongly to the grain boundaries (GBs) during HPT. Further ageing treatment after HPT leads to the segregation of clusters to the dislocations. A strengthening model that incorporates dislocation hardening, grain boundary hardening, solid solution strengthening and a new short-range order strengthening mechanisms was used to predict the yield strength of the alloy. This model indicates that the combined effect due to all three types of Cu-Mg clusters (clustering in matrix, clustering at GBs and at dislocations) is dominant for the strength in all conditions.
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高压扭转与时效硬化相结合实现铝铜锂合金超高强度
研究了新开发的第三代Al-Cu-Li合金的高压扭转和时效硬化联合强化效果。固溶处理后的样品在室温下进行HPT处理,然后进行低温人工时效(即T4-HPT-AA)。经110℃/60h时效处理后,合金显微硬度达到~240 Hv。HPT前预时效110°C/24h, HPT后时效110°C/ 180h(即T6-HPT-AA),硬度进一步提高到~260 Hv。与T4条件(~ 120hv)相比,这些新型的多阶段工艺使硬度提高了2倍。高温热处理后,晶粒尺寸显著细化为超细晶(UFG)组织,并伴有大量位错。HPT及后续时效处理后未观察到长程有序析出物。相反,原子探针断层扫描(APT)提供了明确的证据,表明Cu-Mg共团簇均匀分布在T4和T6处理样品的基体中,并且在HPT过程中向晶界(GBs)强烈偏析。HPT后进一步的时效处理导致位错簇的偏析。采用位错强化、晶界强化、固溶强化和一种新的短时强化机制的强化模型预测合金的屈服强度。该模型表明,在所有条件下,所有三种类型的Cu-Mg团簇(基体团簇、GBs团簇和位错团簇)的综合效应对强度起主导作用。
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