Methods for the microfabrication of magnesium

2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan) Pub Date : 2013-03-07 DOI:10.1109/MEMSYS.2013.6474249

M. Tsang, F. Herrault, R. Shafer, M. Allen

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引用次数: 7

Abstract

The mechanical and electrochemical properties of magnesium are favorable for biomedical and energy storage applications. However, magnesium microfabrication has been limited to sub-micron-thick film technologies (i.e., sputtering or evaporation). This paper presents three magnesium microfabrication approaches for thicknesses greater than 10 μm: 1) laser-cutting and 2) chemical etching of 70-μm-thick commercial magnesium foil; and 3) through-mold electroplating of magnesium from non-aqueous solution. The fabrication technologies are compared on minimum feature size, morphology, uniformity, composition and electrical resistivity. Preliminary results confirmed that the 50-μm-thick electroplated material composition compared favorably with commercial magnesium foil. The measured electrical resistivities of commercial and electrodeposited magnesium were 5.3 μΩ·cm and 8.7 μΩ·cm, respectively. Thick magnesium microstructures can be fabricated through several means to serve a broad range of MEMS-based applications.

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镁的微加工方法

镁的力学和电化学性能有利于生物医学和储能应用。然而，镁的微加工仅限于亚微米厚的薄膜技术(即溅射或蒸发)。提出了厚度大于10 μm的三种镁微细加工方法:70 μm厚商用镁箔的激光切割和化学刻蚀;3)非水溶液镁的透模电镀。从最小特征尺寸、形貌、均匀性、成分和电阻率等方面对制备工艺进行了比较。初步结果证实，所制备的50 μm厚的电镀材料组成优于市售镁箔。测得商品镁和电沉积镁的电阻率分别为5.3 μΩ·cm和8.7 μΩ·cm。厚镁微结构可以通过几种方法制造，以服务于广泛的基于mems的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS 2013) : Taipei, Taiwan, 20-24 January 2013. IEEE International Conference on Micro Electro Mechanical Systems (26th : 2013 : Taipei, Taiwan)

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