Environmental improvements through media packaging

K. Kippes, P. Dunaway, J. Biggs, Ryan Parrot, David Young, Charlie Hill
{"title":"Environmental improvements through media packaging","authors":"K. Kippes, P. Dunaway, J. Biggs, Ryan Parrot, David Young, Charlie Hill","doi":"10.1109/ASMC49169.2020.9185194","DOIUrl":null,"url":null,"abstract":"This poster abstract will focus on environmentally friendly media and packaging solutions engineered by the Transport Materials and Media Engineering (TMME) group within Intel’s Logistics Division. The TMME group has made many improvements that have reduced the environmental impact of our shipping media and packaging materials for our factories thereby reducing our material and freight cost while also reducing our total carbon footprint.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"19 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185194","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

This poster abstract will focus on environmentally friendly media and packaging solutions engineered by the Transport Materials and Media Engineering (TMME) group within Intel’s Logistics Division. The TMME group has made many improvements that have reduced the environmental impact of our shipping media and packaging materials for our factories thereby reducing our material and freight cost while also reducing our total carbon footprint.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
通过媒体包装改善环境
这张海报摘要将重点介绍由英特尔物流部门运输材料和媒体工程(TMME)集团设计的环保媒体和包装解决方案。TMME集团已经做出了许多改进,减少了我们工厂的运输介质和包装材料对环境的影响,从而降低了我们的材料和运费成本,同时也减少了我们的总碳足迹。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Systematic Missing Pattern Defects Introduced by Topcoat Change at PC Lithography: A Case Study in the Tandem Usage of Inspection Methods Computational Process Control Compatible Dimensional Metrology Tool: Through-focus Scanning Optical Microscopy Characterization of Sub-micron Metal Line Arrays Using Picosecond Ultrasonics An Artificial Neural Network Based Algorithm For Real Time Dispatching Decisions A Framework for Semi-Automated Fault Detection Configuration with Automated Feature Extraction and Limits Setting
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1