Atomic layer deposition of dopants for recoil implantation in finFET sidewalls

Abstract

The doping of finFET sidewalls is studied using glancing angle, energetic ion beam recoil mixing of dopant-rich layers made by atomic layer deposited (ALD) films on vertical Si(100) surfaces. Density Function Theory (DTF) calculations show that surface conditions for initiating ALD with BF3 and PF3 dopants favor hydroxyl-Si surface termination. Monte Carlo calculations of the recoil-delivered-B highlights the process control advantages of grazing angle incidence energetic ion beams, as long as the deposited dopant layers are well controlled in thickness and composition, as one expects from ALD methods.