Staggering Preventive Maintenance Actions at CMP Using a Dispatching Algorithm

S. Ramakrishnan, Shiladitya Chakravorty, Jensen Tay, David Olsen, Peter Zumpano
{"title":"Staggering Preventive Maintenance Actions at CMP Using a Dispatching Algorithm","authors":"S. Ramakrishnan, Shiladitya Chakravorty, Jensen Tay, David Olsen, Peter Zumpano","doi":"10.1109/ASMC49169.2020.9185225","DOIUrl":null,"url":null,"abstract":"In a semiconductor fab, distributing wafers equally across a toolset (set of tools that perform similar operations) helps achieve a higher throughput as opposed to loading them unevenly. However, in some processing steps, level loading tools leads to uniform usage of consumables (material used up at a tool in processing wafers) and can trigger simultaneous Preventive Maintenance (PM) actions to replenish them. Managing simultaneous PMs with a small maintenance team reduces tool availability while using a bigger workforce entails higher costs. This study presents ways to overcome this situation by staggering PM actions across tools","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"8 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185225","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

In a semiconductor fab, distributing wafers equally across a toolset (set of tools that perform similar operations) helps achieve a higher throughput as opposed to loading them unevenly. However, in some processing steps, level loading tools leads to uniform usage of consumables (material used up at a tool in processing wafers) and can trigger simultaneous Preventive Maintenance (PM) actions to replenish them. Managing simultaneous PMs with a small maintenance team reduces tool availability while using a bigger workforce entails higher costs. This study presents ways to overcome this situation by staggering PM actions across tools
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
调度算法在CMP上错开预防性维护动作
在半导体晶圆厂中,将晶圆均匀地分布在一个工具集(执行类似操作的一组工具)上,有助于实现更高的吞吐量,而不是不均匀地加载它们。然而,在某些加工步骤中,水平加载工具导致耗材(在加工晶圆时在工具上使用的材料)的均匀使用,并可能触发同时的预防性维护(PM)行动来补充耗材。同时管理一个小型维护团队的pm会降低工具的可用性,而使用更大的劳动力则需要更高的成本。本研究提出了通过跨工具错开PM操作来克服这种情况的方法
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Systematic Missing Pattern Defects Introduced by Topcoat Change at PC Lithography: A Case Study in the Tandem Usage of Inspection Methods Computational Process Control Compatible Dimensional Metrology Tool: Through-focus Scanning Optical Microscopy Characterization of Sub-micron Metal Line Arrays Using Picosecond Ultrasonics An Artificial Neural Network Based Algorithm For Real Time Dispatching Decisions A Framework for Semi-Automated Fault Detection Configuration with Automated Feature Extraction and Limits Setting
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1