{"title":"Electromigration behavior of Cu-core/Sn-shell solder joints","authors":"Wenkai Mu, Wei Zhou, P. Wu","doi":"10.1109/ISAPM.2011.6105724","DOIUrl":null,"url":null,"abstract":"The electromigration behavior of a solder joint with Cu-core/Sn-shell structure under 1.3×104 A/cm2 was investigated in this work. As Cu has lower electrical resistivity than Sn, the Cu core was chosen primarily as the path for current flux. Compared with the traditional solder joint, this core/shell solder has two couples of cathode and anode due to the additional Cu core. It is found that most morphology changes appeared at the region where current crowding occurred according to finite element simulation. Under electron wind force, some Sn grain at the anodes rotated as a result of stress relaxation and the angle of the rotation increased with prolonging the stressing time. No obvious intermetallic compound growth was found.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Symposium on Advanced Packaging Materials (APM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2011.6105724","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The electromigration behavior of a solder joint with Cu-core/Sn-shell structure under 1.3×104 A/cm2 was investigated in this work. As Cu has lower electrical resistivity than Sn, the Cu core was chosen primarily as the path for current flux. Compared with the traditional solder joint, this core/shell solder has two couples of cathode and anode due to the additional Cu core. It is found that most morphology changes appeared at the region where current crowding occurred according to finite element simulation. Under electron wind force, some Sn grain at the anodes rotated as a result of stress relaxation and the angle of the rotation increased with prolonging the stressing time. No obvious intermetallic compound growth was found.
研究了铜芯/锡壳结构焊点在1.3×104 a /cm2下的电迁移行为。由于铜的电阻率比锡低，因此主要选择铜铁芯作为电流通量的路径。与传统焊点相比，由于增加了铜芯，该焊点具有阴极和阳极两对。通过有限元模拟发现，形貌变化主要发生在电流拥挤发生的区域。在电子风的作用下，阳极处的Sn晶粒由于应力松弛而发生旋转，且旋转角度随应力时间的延长而增大。未发现明显的金属间化合物生长。
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