Shung-Wen Kang, Meng-chang Tsai, M. Weng, Chao-Hsiang Hsu
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引用次数: 2
Abstract
Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.
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