Yong Liu, Ping-Hsuan Hsieh, Seongwon Kim, Jae-sun Seo, R. Montoye, Leland Chang, J. Tierno, D. Friedman
{"title":"A 0.1pJ/b 5-to-10Gb/s charge-recycling stacked low-power I/O for on-chip signaling in 45nm CMOS SOI","authors":"Yong Liu, Ping-Hsuan Hsieh, Seongwon Kim, Jae-sun Seo, R. Montoye, Leland Chang, J. Tierno, D. Friedman","doi":"10.1109/ISSCC.2013.6487787","DOIUrl":null,"url":null,"abstract":"Compact low-power signaling schemes to drive on-chip interconnects are needed for processor chips where high-bandwidth data buses connect processor cores and on-chip cache. Since a significant portion of the signaling power is dynamic power spent on driving long wires, reducing the signal swing improves power efficiency [1-3]. In addition, charge-recycling techniques reduce signal swing by stacking circuits with regular and predictable data switching activities, such as logic circuits [4] and clocking circuits [5]. Unlike conventional schemes, low-swing I/O that leverages charge-recycling techniques offers the potential for quadratic power reduction. We present a compact low-power I/O for on-chip signaling using charge-recycling stacked drivers and compact voltage regulators/converters. A receiver circuit modified from a parametric amplifier-based design [6] further improves the area and power efficiency.","PeriodicalId":6378,"journal":{"name":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","volume":"21 1","pages":"400-401"},"PeriodicalIF":0.0000,"publicationDate":"2013-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2013.6487787","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
Compact low-power signaling schemes to drive on-chip interconnects are needed for processor chips where high-bandwidth data buses connect processor cores and on-chip cache. Since a significant portion of the signaling power is dynamic power spent on driving long wires, reducing the signal swing improves power efficiency [1-3]. In addition, charge-recycling techniques reduce signal swing by stacking circuits with regular and predictable data switching activities, such as logic circuits [4] and clocking circuits [5]. Unlike conventional schemes, low-swing I/O that leverages charge-recycling techniques offers the potential for quadratic power reduction. We present a compact low-power I/O for on-chip signaling using charge-recycling stacked drivers and compact voltage regulators/converters. A receiver circuit modified from a parametric amplifier-based design [6] further improves the area and power efficiency.