Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit

S. Lin, Frank Yong
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Abstract

As a process node is getting smaller, the types of failure mechanisms are increasing. New EFA technologies and methods are constantly development. One of the main changes EFA analyses is an enhancement of dynamic EFA in circuit failed in functional test. We propose a technique for advanced Electrical Failure Analysis (EFA) tool with a Picosecond Imaging Circuit Analysis (PICA) detector with enhanced sensitivity for discussing Time Resolved Emission (TRE). The key applications where the time-resolved imaging capability is very effective in reducing the debug time and improving the understanding the failure behaviors of VLSI chip for fault characteristics
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VLSI电路的低压时间分辨发射(TRE)测量
随着工艺节点越来越小,失效机制的类型也越来越多。新的全民教育技术和方法不断发展。EFA分析的一个主要变化是在功能测试失败的电路中增强了动态EFA。我们提出了一种先进的电气故障分析(EFA)工具技术,该工具带有皮秒成像电路分析(PICA)探测器,具有增强的灵敏度,用于讨论时间分辨发射(TRE)。在关键应用中,时间分辨成像能力在减少调试时间和提高对VLSI芯片故障特征的故障行为的理解方面非常有效
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