Explicit transient thermal simulation of liquid-cooled 3D ICs

Alain Fourmigue, G. Beltrame, G. Nicolescu
{"title":"Explicit transient thermal simulation of liquid-cooled 3D ICs","authors":"Alain Fourmigue, G. Beltrame, G. Nicolescu","doi":"10.7873/DATE.2013.283","DOIUrl":null,"url":null,"abstract":"The high heat flux and compact structure of three-dimensional circuits (3D ICs) make conventional air-cooled devices more subsceptible to overheating. Liquid cooling is an alternative that can improve heat dissipation, and reduce thermal issues. Fast and accurate thermal models are needed to appropriately dimension the cooling system at design time. Several models have been proposed to study different designs, but generally with low simulation performance. In this paper, we present an efficient model of the transient thermal behaviour of liquid-cooled 3D ICs. In our experiments, our approach is 60 times faster and uses 600 times less memory than state-of-the-art models, while maintaining the same level of accuracy.","PeriodicalId":6310,"journal":{"name":"2013 Design, Automation & Test in Europe Conference & Exhibition (DATE)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2013-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Design, Automation & Test in Europe Conference & Exhibition (DATE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.7873/DATE.2013.283","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

The high heat flux and compact structure of three-dimensional circuits (3D ICs) make conventional air-cooled devices more subsceptible to overheating. Liquid cooling is an alternative that can improve heat dissipation, and reduce thermal issues. Fast and accurate thermal models are needed to appropriately dimension the cooling system at design time. Several models have been proposed to study different designs, but generally with low simulation performance. In this paper, we present an efficient model of the transient thermal behaviour of liquid-cooled 3D ICs. In our experiments, our approach is 60 times faster and uses 600 times less memory than state-of-the-art models, while maintaining the same level of accuracy.
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液冷三维集成电路的显式瞬态热模拟
三维电路的高热流密度和紧凑的结构使得传统的风冷器件更容易过热。液体冷却是一种替代方案,可以改善散热,减少热问题。在设计时,需要快速准确的热模型来适当地确定冷却系统的尺寸。人们提出了几种模型来研究不同的设计,但普遍具有较低的仿真性能。在本文中,我们提出了一个有效的液冷三维集成电路的瞬态热行为模型。在我们的实验中,我们的方法比最先进的模型快60倍,使用的内存少600倍,同时保持相同的精度水平。
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