Anomalous minority carrier behavior induced by chemical surface passivation solution in p-type GaSb metal–oxide–semiconductor capacitors on Si substrates

S. Sasaki, K. Dropiewski, S. Madisetti, V. Tokranov, M. Yakimov, S. Oktyabrsky
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Abstract

p-type GaSb metal–oxide–semiconductor capacitors with thin InAs surface capping layers were prepared on Si(001) substrates. Epitaxial structures with superlattice metamorphic buffer layers were grown by molecular beam epitaxy. Chemical surface treatment and atomic layer deposition methods were employed for a semiconductor surface passivation and Al2O3 high-k oxide fabrication, respectively. Capacitance-voltage measurements and scanning and transmission electron microscopies were used to correlate electrical properties with the oxide-semiconductor interface structure of the capacitors. Unexpectedly, fast minority carrier response present down to liquid nitrogen temperature was observed in the capacitors passivated by an ammonium sulfide solution. This fast response was found to be related to etch pitlike surface morphology developed upon chemical passivation at the surface steps formed by microtwins and antiphase domain boundaries. Preferential InAs etching by ammonium sulfide at the surface defects was confirmed by analytical TEM studies. Very low activation energy of minority carrier response suggests the presence of electron sources under the gate; they result from growth-related surface defects that give rise to potential fluctuations of as high as half the GaSb bandgap.
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化学表面钝化溶液诱导Si衬底p型GaSb金属氧化物半导体电容器的反常少数载流子行为
在Si(001)衬底上制备了具有薄InAs表面盖层的p型GaSb金属氧化物半导体电容器。采用分子束外延法生长了具有超晶格变质缓冲层的外延结构。采用化学表面处理和原子层沉积方法分别制备了半导体表面钝化和Al2O3高k氧化物。电容电压测量、扫描电镜和透射电镜分析了电容器的电学特性与氧化物-半导体界面结构的关系。出乎意料的是,在硫化铵溶液钝化的电容器中,观察到快速的少数载流子响应直至液氮温度。发现这种快速响应与微孪晶和反相畴边界形成的表面步骤化学钝化后形成的蚀刻坑状表面形貌有关。通过TEM分析证实了硫化铵对表面缺陷的优先蚀刻。极低的少数载流子响应活化能表明栅极下存在电子源;它们是由生长相关的表面缺陷引起的,这些缺陷会导致高达一半的GaSb带隙的潜在波动。
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