Challenges of Coating Deposition on Polymer Substrate by Magnetron Sputtering

S. Dudin, S. Yakovin, A. Zykov, N. Yefymenko, Oleksandr Dakhov
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Abstract

Hard coating deposition on plastics by magnetron sputtering encounters the common problem of the coating delamination if its thickness is more than 50-100 nm. The present study researches Tantalum-based coating deposition focusing on the optimal deposition regimes allowing thicker coating deposition on Polypropylene substrates without delamination. It is shown that the main reason for the delamination is compressive stress in the coating appearing due to bombardment by energetic particles. The delamination problem solution has been found in decreasing the bombarding particle energy by increasing gas pressure.
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磁控溅射在聚合物基底上沉积涂层的挑战
磁控溅射在塑料上沉积硬涂层,当其厚度超过50- 100nm时,会遇到涂层分层的常见问题。本研究对钽基涂层沉积进行了研究,重点研究了在聚丙烯基底上沉积较厚涂层而不发生分层的最佳沉积制度。结果表明,导致分层的主要原因是高能粒子轰击涂层产生的压应力。通过增加气体压力来降低轰击粒子的能量,找到了解决分层问题的方法。
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