S. Liang, Du-Cheng Tsai, Z. Chang, Tai-Nan Lin, M. Shiao, F. Shieu
{"title":"Thermally Stable TiVCrZrHf Nitride Films as Diffusion Barriers in Copper Metallization","authors":"S. Liang, Du-Cheng Tsai, Z. Chang, Tai-Nan Lin, M. Shiao, F. Shieu","doi":"10.1149/2.012201ESL","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":11627,"journal":{"name":"Electrochemical and Solid State Letters","volume":"65 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2012-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"26","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrochemical and Solid State Letters","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1149/2.012201ESL","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}