Investigation of parasitic electromagnetic radiation in multilayer packages and MCMs

Abstract

Electromagnetic radiation from parallel-plate planes of power-return and ground pairs are investigated. Such structures are widely used in microwave multilayer packages, MCMs and could be the source of considerable electromagnetic interference (EMI) or simultaneously switching noise (SSI). Effective methods should be applied for damping and elimination of the radiated fields, especially in small areas and volumes. The developed three-layered LTCC microwave package possesses two separate grounding planes on different layer levels, connected through multiple vias. The estimation of the electromagnetic field distribution — near field, and radiation pattern — far field, are conducted by full-wave analysis. The article also discusses the influence of the layout, vias grid and material properties on the performance of the exemplary structure in the frequency band of interest - 10 to 30 GHz.