Effect of electroless palladium immersion gold deposit properties on gold wire bonding

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Pub Date : 2009-10-01 DOI:10.1109/IMPACT.2009.5382264

K. W. Dennis, S. L. Yee, Leung Martin Bayes

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Abstract

Microelectronic wire bonding is a widely used and cost effective manufacturing process used to electrically connect integrated circuits (IC) with printed circuit boards (PCBs) or other substrates. The first bond is formed on the chip side and the second bond at the circuit board side. The choice of wire bondable surface finishes used on the circuit board can have a great impact on the reliability of the device. Electroless nickel electroless palladium immersion gold (ENEPIG) is one of the available wirebondable finishes and has been applied in these applications for some time. Although the rate of adoption of ENEPIG has been limited, it is attracting more interest due to increased gold prices, as a replacement for electrolytic nickel gold. This paper will present experimental data that demonstrates the capability of ENEPIG as a versatile surface finish providing reliable gold wire bonding performance. It also confirms that ENEPIG is a viable alternative to electrolytic nickel/gold.

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化学钯浸金性能对金丝键合的影响

微电子线键合是一种广泛使用且具有成本效益的制造工艺，用于将集成电路(IC)与印刷电路板(pcb)或其他基板电连接。第一键在芯片一侧形成，第二键在电路板一侧形成。电路板上使用的线粘合表面光洁度的选择对设备的可靠性有很大的影响。化学镀镍-化学镀钯浸金(ENEPIG)是一种可用的线键合表面处理方法，在这些应用中已经应用了一段时间。尽管ENEPIG的采用率有限，但由于黄金价格上涨，作为电解镍金的替代品，它吸引了更多的兴趣。本文将展示实验数据，证明ENEPIG作为一种多功能表面处理的能力，提供可靠的金丝粘合性能。它还证实了ENEPIG是电解镍/金的可行替代品。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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