{"title":"SiP and Module","authors":"R. Aschenbrenner, K. Pressel, A. Grassmann","doi":"10.4071/2380-4505-2019.1.invitedhir000028","DOIUrl":null,"url":null,"abstract":"\n Invited Session on HETEROGENEOUS INTEGRATION ROADMAP - SiP and Module. Outline: ** SiP Packaging Toolbox - Interconnect; Architecture; Footprint; Functional blocks; and ** Challenges and Solutions - Material, assembly, cost, standardization.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"38 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/2380-4505-2019.1.invitedhir000028","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
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