Fabrication of NbN/AlN/NbN junctions with Al embedding circuits on Si membrane for 1.5 THz SIS mixers

J.-C Villégier , B Delaet , V Larrey , M Salez , Y Delorme , J.-M Munier
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引用次数: 4

Abstract

A process has been developed to fabricate NbN tunnel junctions and 1.5 THz SIS mixers with Al electrodes and Al/SiO2/Al microstrip tuning circuits on thin Si membranes patterned on silicon on insulator wafers (SIMOX). High Josephson current density (Jc up to 2×104 A/cm2) NbN/AlN/NbN and NbN/MgO/NbN SIS junctions have been fabricated with a reasonably good Vm quality factor and energy gap values close to 5 meV at 4.2 K on (100) oriented 3 inches SIMOX wafers covered by a thin (∼8 nm) MgO buffer layer. The sputtering conditions critically influence the dielectric quality of both AlN and MgO tunnel barriers as well as the surface losses of NbN electrodes. 0.6-μm Si/SiO2 membranes are obtained after processing of a whole wafer and etching the individual chips in EDP. Such a technology is applied to the development of a waveguide/membrane SIS mixer for use around 1.5 THz.

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用于1.5 THz SIS混频器的NbN/AlN/NbN结与硅膜上Al包埋电路的制备
本文提出了一种以铝电极和铝/SiO2/Al微带调谐电路为基材,在绝缘体硅片(SIMOX)上制作NbN隧道结和1.5 THz SIS混频器的工艺。高约瑟夫森电流密度(Jc高达2×104 A/cm2) NbN/AlN/NbN和NbN/MgO/NbN SIS结在(100)取向的3英寸SIMOX晶圆上被薄(~ 8 nm) MgO缓冲层覆盖,具有相当好的Vm质量因子和4.2 K时接近5 meV的能隙值。溅射条件对AlN和MgO隧道势垒的介电质量以及NbN电极的表面损耗都有重要影响。在EDP中对整片硅片进行加工并对单个芯片进行蚀刻,得到了0.6 μm Si/SiO2膜。这种技术应用于1.5太赫兹左右使用的波导/膜SIS混频器的开发。
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