Shen-Chun Wu, J. Peng, Shih-Ru Lai, C. Yeh, Yau‐Ming Chen
{"title":"Investigation of the effect of heat leak in loop heat pipes with flat evaporator","authors":"Shen-Chun Wu, J. Peng, Shih-Ru Lai, C. Yeh, Yau‐Ming Chen","doi":"10.1109/IMPACT.2009.5382188","DOIUrl":null,"url":null,"abstract":"Loop heat pipes (LHPs) have a great potential for applications of electronic cooling due to the advantages of high transfer capacity, low thermal resistance and long transport distances.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"22 1","pages":"348-351"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382188","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Loop heat pipes (LHPs) have a great potential for applications of electronic cooling due to the advantages of high transfer capacity, low thermal resistance and long transport distances.
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