快速评估BJT不匹配的根本原因

P. Drennan, C. McAndrew, J. Bates, D. Schroder
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引用次数: 12

摘要

本文提出了一种简单快速地评估工艺参数和几何参数对BJT失配的影响的新技术。根据理想区域的I/sub c/、I/sub b/和/spl beta/失配方差,可以唯一地确定夹紧基片电阻变化、发射极几何尺寸变化以及发射极-基极电流变化的理想分量。基极电流非理想分量的变化可以通过低电平注入区I/sub b/和/spl beta/失配来评估。外部电阻的变化可以从高电流区域的I/sub c/和I/sub b/失配来评估。失配评估可以在每个器件类型和每个模具位置进行6次测量。
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Rapid evaluation of the root causes of BJT mismatch
This paper presents a new technique for the simple and rapid evaluation of the process and geometry parameter contributions to BJT mismatch. The pinched base sheet resistance variation, the geometric emitter size variation, and the ideal component of the emitter-base current variation can be uniquely determined from the I/sub c/, I/sub b/ and /spl beta/ mismatch variances in the ideal region. The variation in the nonideal component of the base current can be evaluated from the I/sub b/ and /spl beta/ mismatch in low level injection region. The variation in extrinsic resistance can be evaluated from the I/sub c/ and I/sub b/ mismatch in the high current region. The mismatch evaluation can be performed with as few as six measurements per device type per die site.
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